The 3470-II automatic wire bonder is designed for first-level, gold or aluminum wire interconnect assemblies used in military and aerospace applications. The machine enables deep access wedge bonds ...
2D cameras for positioning and inspecting ultra-fine wires in semiconductor production. Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results