Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
SolarSpace presented four high-efficiency module products and a portfolio of N-type solar cells in Munich, highlighting its ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
Adoption of silicon carbide (SiC) is becoming more widespread among electric-vehicle (EV) systems such as dc-dc converters, traction inverters, and on-board chargers (OBCs) with bidirectional ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
At SNEC 2026 in Shanghai, GCL System Integration (GCL SI) presented a broader view of its next-generation module strategy, ...
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