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Joint research validates new semiconductor etching process, achieving five times speed improvement

A collaborative research team from Nagoya University and Tokyo Electron Miyagi Ltd. has demonstrated that the company's new ...
Eureka

Tokyo Electron and Nagoya University Develop Ultra-Fast HF Plasma Etching

Discover Tokyo Electron’s new semiconductor etching method for faster, greener, and precise chip production. Read more ...
Semiconductor Engineering

Cryogenic Etch: A Key Enabler Of 3D NAND

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Nature

Plasma Chemistry and Etching Processes in Semiconductor Fabrication

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...
EurekAlert!

Creating smaller, and more powerful, integrated circuits

How's this for precision? Researchers with the University of Houston Cullen College of Engineering are developing technology to knock single atoms off a silicon wafer without disturbing atoms of other ...
Hackaday

silicon dioxide

Building circuits on a silicon chip is a bit like a game of Tetris — you have to lay down layer after layer of different materials while lining up holes in the existing layers with blocks of the ...
Semiconductor Engineering

Using Process Modeling To Enhance Device Uniformity During Self-Aligned Quadruple Patterning

We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...