Design And Reuse

Samsung targets 2nm M2800 as Qualcomm evaluates its foundry

Samsung is reportedly developing its M2800 5G modem toward a 2nm process, while Qualcomm is evaluating Samsung Foundry’s 2nm process for future chips. Qualcomm’s reported status is evaluation, not an ...
Design And Reuse

Sound Ecosystem and Scenario Breakthroughs: Seven Sub-forums of RISC-V China Summit Jointly Explore New AI Opportunities

On October 19, the 6th RISC-V China Summit opened at Shenzhen Convention and Exhibition Center (Futian). As one of the most influential industry events in the global open-source chip sector, this ...
Design And Reuse

What Are the Biggest Challenges in Scaling Android Automotive OS?

Our modern-day vehicles use various communication technologies such as, CAN, CAN-FD, LIN, Automotive Ethernet, and FlexRay.
Design And Reuse

Samsung Prepares Next-Gen 8nm Foundry Technology with Major Improvements

Samsung is upgrading its aging 8nm foundry process. The company reportedly plans to introduce 8LPU+, a new version of its 8nm technology, with better performance and efficiency. This could help the ...
Design And Reuse

Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness

Tenstorrent has released the open source beta of the Open Chiplet Atlas® (OCA) Harness. The Harness is a chiplet design framework that turns the OCA interoperability architecture into reusable, ...
Design And Reuse

After TSMC, Samsung Is Also Reportedly Planning To Hike Chip Prices Amid Demand Surge Fueled By Nvidia, Apple, Tesla And Others

Samsung Electronics (SSNFL) is reportedly raising prices on some advanced foundry services by up to 15% amid surging AI chip demand that has left Taiwan Semiconductor Manufacturing Company (TSM) fully ...
Design And Reuse

Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off

As part of the partnership, NoCs created and generated using Agnisys’ IDS-NoC™ will be verified using Axiomise’ nocProve ® formal verification technology. The collaboration brings together Agnisys’ ...
Design And Reuse

Taiwan's Egis, France's SiPearl team up on chiplet CPU

Taiwanese chip design conglomerate Egis Group signed strategic partnership and investment agreements with French processor designer SiPearl on Thursday, advancing its plans for a platform that ...
Design And Reuse

Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release

The Alliance for Open Media (AOMedia) is a collaborative effort to develop open standards and software for video, audio, still images, and immersive technologies. AOMedia brings together 50+ ...
Design And Reuse

Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI

Rambus adopts ChipAgents agentic AI platform to accelerate its own chip and IP design and verification workflows The partnership brings together tailored Rambus silicon IP and ChipAgents’ agentic AI ...
Design And Reuse

BrainChip Unveils AKD1500 SPI Chip, Bringing Neuromorphic AI to Everyday Edge Devices

AKD1500 SPI pairs with the microcontroller, opening Akida AI to the high-volume MCU market. LAGUNA HILLS, Calif. – BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), ...
Design And Reuse

Processor IP brings generative AI to edge devices

BrainChip’s Sequora processor IP core runs generative AI and large language models (LLMs) directly on battery-powered edge devices, such as earbuds and sensor nodes. It pairs with the company’s Akida ...