A new technical paper titled “Enabling Physical AI at the Edge: Hardware-Accelerated Recovery of System Dynamics” was ...
When it comes to developing faster and smaller chips to power next-generation electronic devices, Silicon is seen as the leading option. This abundant, cheap semiconductor provides acceptable carrier ...
Integration of OSS hardware into prime contractor system further validates OSS capabilities for next-generation 360-degree ...
Mobile tech leader uses CES to outline advances in automotive through key collaborations with Chinese startup technology ...
TEGUAR and SORBA.ai Announce Strategic Hardware Partnership to Accelerate On-Prem Industrial AI Deployment in Critical Environments JACKSONVILLE, FL, UNITED STATES, January 5, 2026 /EINPresswire.com/ ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Ryzen AI Embedded processors that offer higher-performance, lower-latency artificial intelligence to automotive, industrial ...
Texas Instruments (TI) introduced new automotive semiconductors and development resources to enhance safety and autonomy ...
These processors aim to deliver efficient AI performance for OEMs, tier-1 suppliers, and automotive developers.
AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...
AMD launched its Ryzen AI Embedded processor portfolio today, targeting automotive, industrial, and physical AI applications ...
AMD also is updating its workstation-level Ryzen AI Max+ mobile processors with two new models: the 12-core Ryzen AI Max+ 392 and the eight-core Ryzen AI Max+ 388. They’re notable for a system-on-chip ...
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