NXP’s understanding of RF technology has enabled some of the most rugged devices in the industry – know-how that we have instilled into our RF lighting transistors. The very high efficiency of our ...

As chip designs push the limits of speed, size and complexity, the semiconductor industry has set its sights on angstrom-scale device features. High-speed, precise and repeatable plasma power delivery ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...