A TEM lamella of an SRAM was prepared using a FIB-SEM. The lamella was thinned down to a thickness of 50 nm and various STEM images were observed on the FIB-SEM equipped with a STEM detector. BF-STEM image shows the crystal structure of Poly-Si region and surrounding structures. MADDF-STEM image highlights the barrier metal around the W plug. HAADF-STEM image provides Z-contrast according to the average atomic number. Several nm thick gate oxide layer was clearly observed at higher magnification
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A TEM lamella of an SRAM was prepared using a FIB-SEM. The lamella was thinned down to a thickness of 50 nm and various STEM images were observed on the FIB-SEM equipped with a STEM detector. BF-STEM image shows the crystal structure of Poly-Si region and surrounding structures. MADDF-STEM image highlights the barrier metal around the W plug. HAADF-STEM image provides Z-contrast according to the average atomic number. Several nm thick gate oxide layer was clearly observed at higher magnification
123 viewsMay 17, 2023
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Hi There ! We are the official account for Hitachi Electron Microscopes 🔬 Follow us for SEM, TEM and FIB insights ! | Hitachi Electron Microscope
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Hi There ! We are the official account for Hitachi Electron Microscopes 🔬 Follow us for SEM, TEM and FIB insights ! | Hitachi Electron Microscope
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Hi there ! We are the official account for Hitachi Electron Microscopes 🔬 Follow us for topics related to Hitachi SEM, TEM and FIB ! | Hitachi Electron Microscope
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Hi there ! We are the official account for Hitachi Electron Microscopes 🔬 Follow us for topics related to Hitachi SEM, TEM and FIB ! | Hitachi Electron Microscope
87.1K viewsDec 12, 2023
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High quality lamella of Fe single crystal was prepared using FIB-SEM-Ar Triple Beam system. Optimizing the accelerating voltage and the incident angle of Ar ion milling, FIB-induced damage was drastically removed, and dislocations were clearly observed. Available instruments for this measurement are : FIB-SEM-Ar Triple Beam system https://www.hitachi-hightech.com/global/science/products/microscopes/focused-ion-beam-systems/nx2000.html Further details can be found on our membership website with d
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High quality lamella of Fe single crystal was prepared using FIB-SEM-Ar Triple Beam system. Optimizing the accelerating voltage and the incident angle of Ar ion milling, FIB-induced damage was drastically removed, and dislocations were clearly observed. Available instruments for this measurement are : FIB-SEM-Ar Triple Beam system https://www.hitachi-hightech.com/global/science/products/microscopes/focused-ion-beam-systems/nx2000.html Further details can be found on our membership website with d
50 viewsMay 21, 2019
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Processes of Micro-Sampling consisting of rough milling, micro sample pick up, and its mounting onto carrier are fully automated by Auto-MS (Automated Micro-Sampling). The positions of probe, sample and carrier are automatically recognized and controlled to enhance operation efficiency. #Microscope #ElectronMicroscope Available instruments for this measurement are : FIB-SEM https://www.hitachi-hightech.com/global/science/products/microscopes/focused-ion-beam-systems/nx2000.html Micro-sampling sy
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Processes of Micro-Sampling consisting of rough milling, micro sample pick up, and its mounting onto carrier are fully automated by Auto-MS (Automated Micro-Sampling). The positions of probe, sample and carrier are automatically recognized and controlled to enhance operation efficiency. #Microscope #ElectronMicroscope Available instruments for this measurement are : FIB-SEM https://www.hitachi-hightech.com/global/science/products/microscopes/focused-ion-beam-systems/nx2000.html Micro-sampling sy
204 viewsJan 10, 2019
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A TEM lamella of a 176 layered 3D NAND was prepared with uniform thickness throughout whole 11 μm deep channel holes. SiO and Poly Si layers were well observed from top to bottom showing the 100 nm diameter channel holes were thinned down to about 30 nm while keeping their center. The shape of the channel hole joint was also visualized in the middle area. #3DNAND #NAND #ChannelHole #FIB #SEM #FIBSEM #TEM #electronmicroscopy #ElectronMicroscope Available instruments for this measurement are : FIB
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A TEM lamella of a 176 layered 3D NAND was prepared with uniform thickness throughout whole 11 μm deep channel holes. SiO and Poly Si layers were well observed from top to bottom showing the 100 nm diameter channel holes were thinned down to about 30 nm while keeping their center. The shape of the channel hole joint was also visualized in the middle area. #3DNAND #NAND #ChannelHole #FIB #SEM #FIBSEM #TEM #electronmicroscopy #ElectronMicroscope Available instruments for this measurement are : FIB
53 viewsDec 17, 2024
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FIB processes for TEM sample prep from microsample extraction out of bulk sample to lamella thinning and eventually Ar ion beam finishing were automated using a FIB-SEM-Ar Triple Beam system. After Auto-Microsampling (in-situ lift out) and auto-thinning processes, Ar ion beam was automatically irradiated to reduce FIB-induced damage to realize unattended TEM lamella preparation. #Cu #CrystalOrientation #EBSD #GrainBoundary #FIB #SEM #FIBSEM #electronmicroscopy #ElectronMicroscope Available instr
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FIB processes for TEM sample prep from microsample extraction out of bulk sample to lamella thinning and eventually Ar ion beam finishing were automated using a FIB-SEM-Ar Triple Beam system. After Auto-Microsampling (in-situ lift out) and auto-thinning processes, Ar ion beam was automatically irradiated to reduce FIB-induced damage to realize unattended TEM lamella preparation. #Cu #CrystalOrientation #EBSD #GrainBoundary #FIB #SEM #FIBSEM #electronmicroscopy #ElectronMicroscope Available instr
65 viewsSep 13, 2023
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